CAPABILITY

PCB Manufacture

Item Parameter
Max. Layer 16 layers
Material Type FR-4,CEM-3,Aluminum Based, Metal core, High frequency plate,
High Tg, BT, Rogers, Epoxy, Teflon, Kapton Polyimide, PPE etc.
Board Thickness Min. Thick. 0.2mm
Max. Thick. 4.0mm
Finished Board Thickness Tolerance Thick.<0.8mm ±12%
0.8mm-2.0mm ±10%
Thick.>2.0mm ±8%。
Min. Hole Dimension Board Thick.<2.0mm 0.2mm
Board Thick.≥2.0mm Aspect ratio≤10
Max. Panel Dimension 32”x20”(800mmx508mm)
Surface Treatment HASL, Lead free HASL, Immersion Gold/Silver/Tin, Gold Finger ,OSP etc.
Solder Mask Green, White, Yellow, Red, Blue, Black etc.
Legend Min. Track Width/High 5mil /8mil
Color White, Yellow, Black
Base Copper Thickness Inner Copper 0.5oz 3oz
Outer Copper 0.5oz 3oz
Finished Copper Thickness Inner Copper 1oz 5oz
Outer Copper 0.5oz 5oz
Insulated Thickness 0.06mm
Min. Track Width 3mil/4mil
Min. Track Space 3mil/4mil
Plating thickness Technique Plating thickness Min. thickness Max. thickness
P.T.H PTH Wall 20um 25um
Hard-gold plating Nickel 100u” 300u”
Gold 1u” 12u”
Immersion Gold Nickel 100u” 150u”
Gold 1u” 3u”
Min Solder Mask Ring PTH:3mil
>Tooling Hole:6mil
Track to Edge Space CNC:0.25mm;V-CUT:0.4mm
Digital Control V-CUT Size 630mm*630mm,Thickness 0.20mm
Impedance Control tolerance% ±10%